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IEC 61188-5-1 Ed. 1.0 b:2002
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IEC 61188-5-1 Ed. 1.0 b:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
standard by International Electrotechnical Commission, 07/12/2002
Full Description
Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.
M00001092
2021-02-22
New product
IEC 61188-5-1 Ed. 1.0 b:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
standard by International Electrotechnical Commission, 07/12/2002