Used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. Revision D provides new design guidance and requirements for material selection and construction, selective (button) plating, minimum bending for flexible circuits with coverlay, impedance and capacitance control, unsupported edge conductors/fingers and copper filled vias/microvias.
Product Details
Published: 09/01/2016 ISBN(s): 9781611932645 Number of Pages: 60 File Size: 1 file , 7.1 MB
M00001262
2021-02-27
New product
IPC 2223D
Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2016